1School of Microelectronics, Shanghai University, Shanghai 201800, China;2State Key Laboratory of Infrared Science and Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;3School of Microelectronics and School of Integrated Circuits, Nantong University, Nantong 226019, China
Supported by the National Key Research and Development Program of China (Grant Nos. 2023YFB3611400 and 2025YFF0524500 ), National Natural Science Foundation of China (Grant Nos. 62475275, 62174063, 62174061, U24A20295, 62404230), China Postdoctoral Science Foundation (Grant Nos. 2023TQ0362, GZB20230795, 2024M753366), Basic and Applied Basic Research Foundation of Guangdong Province (Grant No. 2023B1515120049), and the National Science Centre (NCN) and the National Natural Science Foundation of China (NSFC)
