1.State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;2.University of the Chinese Academy of Sciences, Beijing 100049, China;3.School of Microelectronics, Shanghai University, Shanghai 201800, China
Supported by the National Natural Science Foundation of China (62204250) and the Autonomous deployment project of State Key Laboratory of Materials for Integrated Circuits (SKLJC-Z2024-A05).
