Low power application specific SoC chip for uncooled infrared image processing

1.State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;2.College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China

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National Key R&D Program of China (2019YFB2204303), National Natural Science Foundation of China (U20A20205)

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    Uncooled infrared imaging technology has a very broad application prospect. However, there are some urgent problems to be solved, such as non-uniformity correction, image detail enhancement and stripe noise. This paper proposes and designs a special SoC chip for image processing for uncooled infrared imaging. The chip integrates a CPU, two DSP processors and a special accelerator for infrared image processing. A single chip can realize real-time image processing such as non-uniformity correction, image filtering, histogram equalization, digital image detail enhancement, stripe elimination and target detection and tracking. At the same time, research and development of uncooled low-power infrared image processing algorithms for chip applications. The 65-nm CMOS process is used to realize the special processing SoC chip for uncooled infrared images, and a small and low-power uncooled infrared imaging system based on the uncooled infrared imaging chip and the image processing SoC chip is realized. The test results show that the imaging system can realize functions such as clear uncooled infrared imaging, target detection and target tracking. The power consumption of the system is less than 2 W, and the volume is reduced by 50% compared with the traditional system. It meets the application requirements of systems with high requirements for volume, power consumption and performance, and has high engineering application value and prospect.

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GUO Guang-Hao, WU Nan-Jian, LIU Li-Yuan. Low power application specific SoC chip for uncooled infrared image processing[J]. Journal of Infrared and Millimeter Waves,2023,42(1):122~131

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  • Received:April 09,2022
  • Revised:January 06,2023
  • Adopted:June 09,2022
  • Online: January 03,2023
  • Published: