1.Laboratory of Silicon-Based Materials and Integrated Devices， Shanghai Institute of Microsystem and Information Technology， Chinese Academy of Sciences， Shanghai 200050， China;2.University of Chinese Academy of Sciences， Beijing 100049， China;3.Department of Electronic Engineering， Xi’an University of Technology， Xi’an 710048， China;4.Shanghai Industrial μTechnology Research Institute， Shanghai 201800， China

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Supported by National Key Research and Development Program of China （2019YFB2203502）， Shanghai Sailing Program （20YF1456900）， Strategic Pioneer Research Projects of Defense Science and Technology （XDB43020500）， and National Outstanding Youth Foundation of China （61904185）