1.上海大学 微电子学院,上海 201800;2.中国科学院 上海技术物理研究所 红外成像材料与器件重点实验室,上海 200083
中国科学院战略性先导科技专项(XDB0980000);国家自然科学基金(62335017, 62222412, 62104236, 62104237);上海市扬帆计划(22YF1455800, 21YF1455000);中国科学院上海技术物理研究所创新专项基金(CX-513,CX-567)
1.School of Microelectronics, Shanghai University, Shanghai 201800 , China;2.Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
the Chinese Academy of Sciences (Grant No. XDB0980000); the National Natural Science Foundation of China (62335017, 62222412, 62104236, 62104237), the Shanghai Sailing Program (Grant No. 22YF1455800, 21YF1455000), Special Innovation Program of Shanghai Institute of Technical Physics, Chinese Academy of Sciences (Grant No.CX-513, CX-567)