基于4.3 THz量子级联激光器的微米级无损厚度测量
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中国科学院上海微系统与信息技术研究所

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Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser
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Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences

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    摘要:

    构建和描述了一种用于获取硅片厚度的零差检测系统。利用4.3-THz激光束的传输相变与机械旋转台控制的入射角之间的关系,可以使用标准残差法精确推导被测样品的厚度值。结果表明,样品的厚度拟合值与光学显微镜的精确测量结果仅相差2.5~3 μm,实现了微米级精度的太赫兹无损厚度测量。实验验证了太赫兹量子级联激光器在非接触无损测量中的有效性。

    Abstract:

    A homodyne detection system to acquire the thickness of silicon wafers is constructed and described. By harnessing the relationship between the transmission phase change of a 4.3-THz light beam and the incident angle controlled by a mechanical rotating stage, the thickness value of sample can be precisely deduced using the standard residual error method. The results indicate that the fitted thickness of the sample differs by only 2.5~3 μm from more accurate results measured by optical microscopes, achieving terahertz non-destructive thickness measurement with micron level accuracy. The experiment validates the effectiveness of terahertz quantum-cascade laser in non-contact and nondestructive measurement.

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历史
  • 收稿日期:2023-08-28
  • 最后修改日期:2023-09-10
  • 录用日期:2023-09-13
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