基于键合金丝补偿的太赫兹瓦级功率合成技术研究
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作者单位:

1.南京航空航天大学 电磁频谱空间认知动态系统工业和信息化部重点实验室,江苏 南京 211106;2.南京电子器件研究所,江苏 南京 210016;3.东南大学 毫米波国家重点实验室,江苏 南京 210096

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中图分类号:

TN722.75

基金项目:

中央高校基本科研业务费专项资金资助(NF2020003),重点实验室基金(612502200302)


Research on watt-level power combining technology at terahertz band based on bonding wire compensation
Author:
Affiliation:

1.Key Laboratory of Dynamic Cognitive System of Electromagnetic Spectrum Space, Ministry of Industry and Information Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, China;2.Nanjing Electronic Device Institute, Nanjing 210016, China;3.State Key Laboratory of Millimeter Waves, Southeast University, Nanjing 210096, China

Fund Project:

Supported by the Fundamental Research Funds for the Central Universities(NF2020003),key Laboratory Fund(612502200302)

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    摘要:

    针对太赫兹波段固态大功率应用需求,基于氮化镓功率放大器单片集成电路(Monolithic Microwave Integrated Circuit,MMIC),采用功率合成技术实现了太赫兹波段瓦级功率输出。通过太赫兹波段微带/波导转换结构和键合金丝补偿技术,结合E面T型结二路合成功率分配/合成器,将两片MMIC封装成最大输出功率为160 mW的功率单元模块。在此基础上,采用八路E面合成器设计了频率覆盖180~238 GHz的十六路功率合成放大器。在漏极电压为+10 V时,带内输出功率大于300 mW,189 GHz输出功率达到了1.03 W。

    Abstract:

    With the application demands of solid-state high power in the terahertz (THz) band, a THz-band watt-level power output is achieved by adopting GaN power amplifier (PA) MMIC and power combining technology. Microstrip-waveguide transition, and the low-loss interconnection based on the gold wire compensation are used to package a PA module composed of two PA MMICs and an E-plane T-junction two-way power splitter/combiner. Maximum output power of 160 mW is achieved. Based on the module and an eight-way E-plane combiner, a sixteen-way power combining amplifier is designed across the frequency range of 180 to 238 GHz. Output power of more than 300 mW is achieved with +10 V drain voltage, and the maximum power is 1.03 W at 189 GHz.

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朱翔,张俊杰,成海峰,郭健,施永荣,王维波.基于键合金丝补偿的太赫兹瓦级功率合成技术研究[J].红外与毫米波学报,2023,42(6):747~754]. ZHU Xiang, ZHANG Jun-Jie, CHENG Hai-Feng, GUO Jian, SHI Yong-Rong, WANG Wei-Bo. Research on watt-level power combining technology at terahertz band based on bonding wire compensation[J]. J. Infrared Millim. Waves,2023,42(6):747~754.]

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  • 收稿日期:2022-11-10
  • 最后修改日期:2023-06-07
  • 录用日期:2023-02-01
  • 在线发布日期: 2023-06-02
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