1.国科大杭州高等研究院 物理与光电工程学院,浙江 杭州 310024;2.中国科学院上海技术物理研究所 红外成像材料与器件重点实验室,上海 200083
TN304.2;TN305
国家自然科学基金(61904183, 61974152, 62104237,62004205),中国科学院青年创新促进会会员资助(Y202057),上海市科技启明星计划(20QA1410500),上海市扬帆计划(21YF1455000)
1.School of Physics and Optoelectronic Engineering, Hangzhou Institute for Advanced Study, University of Chinese Academy of Sciences, Hangzhou 310024, China;2.Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
National Natural Science Foundation of China (NSFC) (61904183, 61974152,62104237,62004205), the Youth Innovation Promotion Association of the Chinese Academy of Sciences (Y202057), Shanghai Rising-Star Program (20QA1410500), Shanghai Sail Plans (21YF1455000)
柴旭良,周易,王芳芳,徐志成,梁钊铭,朱艺红,周建,郑露露,黄敏,白治中,黄爱波,陈红雷,丁瑞军,陈建新.面向高工作温度应用的带间级联红外光电器件[J].红外与毫米波学报,2022,41(1):122~128]. CHAI Xu-Liang, ZHOU Yi, WANG Fang-Fang, XU Zhi-Cheng, LIANG Zhao-Ming, ZHU Yi-Hong, ZHOU Jian, ZHENG Lu-Lu, HUANG Min, BAI Zhi-Zhong, HUANG Ai-Bo, CHEN Hong-Lei, DING Rui-Jun, CHEN Jian-Xin. Interband cascaded infrared optoelectronic devices for high operating temperature applications[J]. J. Infrared Millim. Waves,2022,41(1):122~128.]
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