基于硅微机械加工波导W波段功率合成放大器
作者:
作者单位:

1.东南大学 毫米波国家重点实验室,江苏 南京 210096;2.南京电子器件研究所,江苏 南京 210016

中图分类号:

TN73

基金项目:

国家重点研发计划重点专项(2019YFB2204701),国家自然科学基金项目(61831006、61701112),中央高校基本科研业务费专项资金资助(2242019K40196)


Research on W-band power combining amplifier based on Silicon Micromachined Waveguide
Author:
Affiliation:

1.State Key Laboratory of Millimeter Wave, Southeast University, Nanjing 210096,China;2.Nanjing Electronic Device Institute, Nanjing 210016, China

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    摘要:

    基于硅微机械加工工艺,设计并制作一款W波段4路硅基波导功分/合成器。通过在8英寸的硅晶圆上采用干法刻蚀和晶圆级键合等工艺途径实现了硅基波导结构。根据硅微机械加工工艺的特点,设计了一种基于H面T型结和3dB耦合桥结构的波导功分/合成器。该功分/合成器表现出了的损耗为0.25 dB。最后,采用该硅基功分/合成器对4只2W的GaN功率单片进行了功率合成,研制了W波段硅基合成功率放大器。测试结果表明,在92~96 GHz的频率范围内,输入功率30 dBm的条件下,输出功率在7.03 W至8.05 W之间,典型电源附加效率15%,平均合成效率为88%。

    Abstract:

    Based on the silicon micromachined technology, a W-band 4-way silicon waveguide power splitter/combiner was designed and fabricated in this paper. The silicon waveguide has been realized by dry etching and wafer level bonding on an 8 inch silicon wafer. According to the characteristics of silicon micromachining, a waveguide power splitter/ combiner based on H-plane T-junction and 3dB coupler was designed. This silicon splitter/combiner exhibits extremely low loss. A silicon power combined PA module was developed by using this silicon power splitter/combiner together with four 2W GaN MMICs. The output power is between 7.03W and 8.05W across the frequency range of 92 to 96GHz with an input power of 30dBm, and the typical PAE is 15%. The average combining efficiency is 88%.

    参考文献
    [1] Wu S B, Gao J F, Wang W B, et al. W-Band MMIC PA with ultrahigh power density in 100-nm AlGaN/GaN technology[J]. IEEE Trans. Electron Devices, 2016, 63(10): 3882-3886.
    [2] Ingram D L. Compact W-band solid-state MMIC high power sources[C]. IEEE MTT-S Int. Microwave Symp. Dig., 2000, pp:955-958.
    [3] Kim B , Tran A, Schellenberg J M. Full W-band power amplifier/combiner utilizing GaAs technology[C]. IEEE MTT-S Int. Microwave Symp. Dig., 2012.
    [4] ZHU Xiang, CHENG Hai-Feng, GUO Fang-Jin, et al. W-band solid-state combining power amplifier research[J] Research & Progress of SSE. (朱翔,成海峰,郭方金,等。 W波段固态合成功放研究.固体电子学研究与进展), 2019, 39(04): 240-244.
    [5] Schellenberg J, Watkins E, Micovic M, et al. W-band, 5W solid-state power amplifier/combiner[C]. IEEE MTT-S Int. Microwave Symp. Dig., 2010, pp:23-28.
    [6] Schellenberg J, Tran A, Bui L, et al. 37 W, 75-100 GHz GaN Power Amplifier[C]. IEEE MTT-S Int. Microwave Symp. Dig., 2016, pp:1-4.
    [7] HUANG Zhao-Yu,XU Jun,RAN Dong,et al. Design of a W-band power amplifier /combiner based on spatial power-combining technique [J]. J. Infrared Millim. Waves (黄昭宇,徐军,冉东,等。基于径向波导合成技术的W波段功率放大器设计。红外与毫米波学报),2018,37(04):454-458.
    [8] CHENG Hai-Feng, ZHU Xiang, GUO Jian. Design of W-band low-loss radial power combiner [J]. Research & Progress of SSE. (成海峰,朱翔,郭健。 W波段低损耗径向功率合成器设计.固体电子学研究与进展),2019,39(02):102-105+115.
    [9] Maaskant Rob, Waqar Ali Shah, Ashraf Uz Zaman, et al. Spatial power combining and splitting in gap waveguide technology[J]. IEEE Microwave and Wireless Components Letters, 2016, 26(7):472-474.
    [10] Epp L, Khan P, Silva A. Ka-band wide-band gap solid-state power amplifier: hardware validation [J]. Interplanetary Network Progress Report, 2005, 162.
    [11] Khan P, Epp L, Silva A. A Ka-band wide-bandgap solid-state power amplifier:architecture performance estimates [J].Interplanetary Network Progress Report,2005,162:1-17.
    [12] Silicon Micromachined Waveguide Quadrature-Hybrid Coupler at Terahertz Frequency Band [J]. J. Infrared Millim. Waves, 2015, 36(8):709-719.
    [13] Svedin J, Malmqvist R, Beuerle B, et al. A 230–300 GHz low-loss micromachined waveguide hybrid coupler[C]. EuMC, 2017.
    [14] Zhang F, Song K, Li G, et al. Sub-THz four-way waveguide power combiner with low insertion loss[J]. J. Infrared Millim. Waves, 2014, 35(5):451-457.
    [15] LI Na. Effect of the surface roughness on electrical properties of high performance microwave electronic equipment [D]. Xidian University(李娜。 表面粗糙度对高精度微波电子装备电性能影响的研究. 西安电子科技大学),2012.
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成海峰,朱翔,候芳,胡三明,郭健,石归雄.基于硅微机械加工波导W波段功率合成放大器[J].红外与毫米波学报,2021,40(2):178~183]. CHENG Hai-Feng, ZHU Xiang, HOU Fang, HU San-Ming, GUO Jian, SHI Gui-Xiong. Research on W-band power combining amplifier based on Silicon Micromachined Waveguide[J]. J. Infrared Millim. Waves,2021,40(2):178~183.]

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  • 收稿日期:2020-03-26
  • 最后修改日期:2021-04-02
  • 录用日期:2020-06-15
  • 在线发布日期: 2021-03-30
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