Flat panel Liquid Crystal Displays (LCDs), especially TFT-LCDs have excellent performance, good mass production characteristics, high degree of automation, low cost of raw materials and broad development space. The cutting step plays a pivotal role in the fabrication process of LCDs. The main function of cutting is to process large substrate products. According to the designed cell size, a large substrate is divided into several small cells. The control of the parameters and operation skills in processing has important impact on the strength and function of LCDs. With the development of LCD equipment towards large size, ultra-thin and pixel densification, the requirements of product reliability are becoming higher and higher. How to reduce the impact of cutting on LCD yield and reliability is the focus of this paper.