Research on Characteristics of Wires for Infrared Detector Packaging

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Research on Characteristics of Wires for Infrared Detector Packaging
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Affiliation:State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences,State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences,State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences,State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences,State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences,State Key Laboratories of Transducer Technology,Key Laboratories of Infrared Imaging Materials and Detectors,Shanghai Institute of technical Physics,Chinese Academy of Sciences
Clc Number:TN215
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Abstract:

Wire bonding is one of the key technologies of infrared detector packaging. However, the choice of wires may directly affect the electrical, mechanical and thermal properties of infrared detector modules. Because material, material diameter, material length and lead process need to be considered in wire interconnection, a variety of wires are usually used to meet different demands in the packaging of infrared detectors. The electrical, mechanical and thermal properties of the wires of infrared detector modules are presented systematically. The burn-out current of gold wire, silicon aluminum wire, platinum wire and other wires in atmospheric and vacuum environment is especially tested and analyzed. The burnout current of wires in atmospheric environment is significantly greater than that in vacuum environment. This result is consistent with the empirical formula substantially. The research is of referential value to the packaging of space infrared detectors.

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Wang Yang, Zhao Zhenli, Mo Defeng, et al. Research on Characteristics of Wires for Infrared Detector Packaging[J]. Infrared,2018,39(2):8~13

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