Study of Coupling Factor and Package Structure of InGaAs Optical Detector
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State Key Laboratory of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences Shanghai,State Key Laboratory of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences Shanghai,State Key Laboratory of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences Shanghai,State Key Laboratory of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences Shanghai

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    Abstract:

    A multi-mode silica fiber coupled InGaAs detector was designed. The performance of the chip was measured before and after its coupling. The factors which had influences on its coupling efficiency were analyzed. The result showed that the silica was suitable to be coupled with the InGaAs chip. In the waveband from 0.9 μm to 1.7 μm, the maximum coupling efficiency could be greater than 30 % when an optical fiber with a diameter of 100 μm was used. When an optical fiber with a diameter of 500 μm was used, the maximum coupling efficiency could be greater than 55 %. The light intensity exhibited Gaussian distribution at the exit end of the multi-mode silica optical fiber. With the increase of the distance between the end face of the fiber and the chip surface, the half-width value of the Gaussian distribution curve was increased and the light beam gradually diverged. The transverse offset and longitudinal discrepancy between the chip and the fiber end had a great influence on the coupling efficiency, and the transverse offset was a more significant influence factor.

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Mo De-Feng,Liu Da-Fu,Xu Qin-Fei,et al. Study of Coupling Factor and Package Structure of InGaAs Optical Detector[J]. Infrared,2012,33(3):17~21

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