In large-scale infrared readout integrated circuits (ROIC), the data transfer efficiency and the number of interface circuits are particularly crucial. Traditional interface circuits use parallel interfaces for data transmission, which takes up a significant amount of chip pins. In order to improve the efficiency of data transmission, a 3-channel serial low voltage differential signaling (LVDS) interface circuit is designed for data reception. The circuit adopts a 0.18 μm complementary metal oxide semiconductor (CMOS) process. The simulation results show that the LVDS interface circuit can convert 2-channel receiver data into 8-channel data at a frequency of 400 MHz and output it to the internal digital processing unit. Compared with traditional parallel interfaces, this circuit saves 6 data transmission pins, greatly improving data transmission efficiency.