| 红外组件封装电极板旋光激光加工中的热损伤及其控制 |
| 投稿时间：2024-09-25 修订日期：2024-10-16 点此下载全文 |
| 引用本文：张忆南.红外组件封装电极板旋光激光加工中的热损伤及其控制[J].红外,2025,46(2):20~25 |
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| 中文摘要:红外组件封装中使用各种电极板，在激光加工中需避免对其金属电极造成热损伤。基于对薄圆盘样品的热传导分析，在合理假设下得出了激光加工过程中样品上稳态温度分布的简明清晰的解析表达式。据此，结合电极板常用基底材料和电极材料的热学参数，得到稳态下金电极蓝宝石电极板的热损伤距离为3.3 mm，并计算了不同厚度的样品所需的激光加工平均功率。此种方法适用于采用不同基底和电极材料的电极板或芯片等的激光加工中相关参数的设定以及热损伤区域大小的估计，避免了复杂的有限元模拟，可指导电极板设计、匹配以及设定激光加工参数。 |
| 中文关键词:激光加工 旋光切割 热分布 热损伤 蓝宝石片 |
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| Thermal Damage and Its Control in Helical Laser Processing of Infrared Module Electrode Plates for Packaging |
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| Abstract:Various electrode plates are used in infrared module packaging, and thermal damage to their metal electrodes must be avoided during laser processing. Based on the thermal conduction analysis of thin disk samples, a concise and clear analytical expression for the steady-state temperature distribution on the sample during laser processing is obtained under reasonable assumptions. Based on this, combined with the thermal parameters of the commonly used substrate materials and electrode materials of the electrode plate, the thermal damage distance of the sapphire electrode plate with the gold electrode in the steady state is obtained to be 3.3 mm, and the average laser processing power required for samples of different thicknesses is calculated. This method is suitable for the setting of relevant parameters and the estimation of the size of the thermal damage area in the laser processing of electrode plates or chips based on different substrates and electrode materials, avoiding complex finite element simulations, and can guide the design and matching of electrode plates and the setting of laser processing parameters. |
| keywords:laser processing helical cutting thermal distribution thermal damage sapphire wafer |
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