| 大规模红外焦平面耦合界面特性评估 |
| 投稿时间：2024-07-27 修订日期：2024-08-17 点此下载全文 |
| 引用本文：马思宇,别枢佑,王静,石洁,郭成达,孟炎雄,孙焕,练敏隆,张一凡.大规模红外焦平面耦合界面特性评估[J].红外,2024,45(10):8~13 |
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| 中文摘要:针对大面阵、长线列等大规模红外焦平面的耦合界面低温冷变形及微振动位移量进行综合评估，以确保焦平面探测器耦合后芯片低温变形量、低温应力以及像元位移量能满足应用需求。通过共轭显微系统对某型号处于80 K工作温度下的红外焦平面进行取点采样，可获得多点的三维坐标系；随即对坐标系进行平面拟合，得到该焦平面的低温变形量及微振动位移量。此红外焦平面低温变形量的仿真计算值为18 μm，实测结果为19 μm；微振动位移量的推论值为0.7 μm，实测结果为0.9 μm。两项实测值均满足指标要求。此型号红外相机在轨成像清晰、层次丰富，表明该方法更加真实、有效地评估出耦合界面低温变形量及微振动位移量，可为后续型号项目提供可靠、有效的保障。 |
| 中文关键词:大规模红外探测器 耦合特性 低温平面度 微振动 |
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| Characteristics Evaluation of Coupling Interface of Large-Scale Infrared Focal Plane |
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| Abstract:The low temperature deformation and micro-vibration displacement of the coupling interface of large-scale infrared focal plane (such as large array and long line array) are comprehensively evaluated to ensure that the chip deformation, stress and pixel displacement at low temperature can meet the application requirements after the coupling of focal plane detector. The point sampling of the infrared focal plane of a certain model at 80 K operating temperature is carried out by the conjugated microscopic system to obtain a multi-point three-dimensional coordinate system, and then the plane fitting of the coordinate system is carried out to obtain the low-temperature deformation and micro-vibration displacement of the focal plane. The low temperature deformation of the infrared focal plane is 18 μm by simulation and 19 μm by measurement. The deduced value of micro-vibration displacement is 0.7 μm, and the measured result is 0.9 μm. Both measured values meet the index requirements. The image of this model of infrared camera is clear in orbit and rich in layers, which indicates that the method is more realistic and effective to evaluate the low temperature deformation and micro-vibration displacement of the coupled interface, and can provide reliable and effective guarantee for the subsequent model projects. |
| keywords:large-scale infrared detector coupling characteristic low temperature flatness micro-vibration |
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