| 像素级滤光片的微米级装配工艺研究 |
| 投稿时间：2023-11-21 修订日期：2023-12-08 点此下载全文 |
| 引用本文：冯志攀,方志浩,刘建娇,付志凯,邢艳蕾,刘亚泽,林国画,王冠.像素级滤光片的微米级装配工艺研究[J].红外,2024,45(12):34~39 |
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| 中文摘要:为满足红外探测器多通道精细分光的应用需求，像素级滤光片需精准地集成在红外探测器组件的冷头上，且滤光片X、Y、Z向装配精度需要控制在10 μm以内，以降低不同通道间的杂散光干扰。基于320×256@30 μm中波红外探测器进行像素级滤光片设计。以探测器上相邻的四个像元为一组，每个像元在像素级滤光片上的对应区域有各自的吸收谱段。通过对比分析胶黏剂和金属滤光片支架分别作为像素级滤光片的支撑结构时的四像元光谱吸收曲线，发现前者的Z向装配间距可低至2~10 μm，截止波段外的杂散光吸收较后者可降低25%~50%。结果表明，将胶黏剂作为滤光片的微支撑结构的装配工艺能够有效解决像素级滤光片的杂散光干扰问题。 |
| 中文关键词:红外探测器 像素级滤光片 封装工艺 |
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| Study on the Micron-Scale Assembly Process of Pixel-Level Filters |
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| Abstract:To meet the application requirements of multi-channel fine spectrometry of infrared detectors, pixel-level filters need to be accurately integrated on the cold head of infrared detector assembly, and the assembly accuracy of the filters in the X, Y and Z directions needs to be controlled within 10 μm to reduce the stray light interference between different channels. The pixel-level filter is designed based on a 320×256@30 μm mid-wave infrared detector. Four adjacent pixels on the detector are grouped together, and each pixel has its own absorption spectrum on the corresponding region of the pixel-level filter. By comparing and analyzing the spectral absorption curves of the four pixels when the adhesive and the metal filter bracket are respectively used as the supporting structure of the pixel-level filter, it is found that the Z-direction assembly spacing of the former can be as low as 2－10 μm, and the stray light absorption outside the cutoff band can be reduced by 25%－50% compared with the latter. The results show that the assembly process using adhesive as the micro-support structure of the filter can effectively solve the stray light interference problem of pixel-level filters. |
| keywords:infrared detector pixel-level filter packaging process |
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