| 红外组件封装电极板旋光激光加工中的热损伤及其控制 |
| 投稿时间：2024-09-25 修订日期：2024-10-16 点此下载全文 |
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| 中文摘要:本文基于对薄圆盘样品的热传导过程的分析，在假设样品尺寸远大于热源区域尺寸及样品厚度的前提下，得出了激光加工过程中样品上的稳态温度分布解析表达式，此表达式形式简洁且参数易于理解。据此，文中结合红外焦平面组件封装中所用电极板常用的实际基底材料和电极材料等的热学参数，以蓝宝石电极板为例，计算了不同条件下所需的旋光激光加工平均功率以及可能产生热损伤区域的大小等，并对旋光模式和振镜扫描模式两种加工方法可能产生热损伤的情况进行了比较。此种方法适用于采用不同基底和电极材料的电极板或芯片等的激光加工中相关参数的设定以及热损伤区域大小的估计，对电极板或芯片的设计、匹配以及激光加工等具有指导作用。 |
| 中文关键词:激光加工 旋光切割 热分布 热损伤 蓝宝石片 |
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| Thermal damage and their control in helical laser processing of infrared module electrode plates for packaging |
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| Abstract:Based on the thermal conduction analysis of thin disk sample under the assumptions of much large sample size compared to the heat source zone size and sample thickness, analytical solution of the stable temperature distribution was achieved. The formulas are with concise forms and comprehensible parameters. Accordingly, using sapphire substrate with gold electrode as an example, which is often used in infrared focal plane array modules, the required average power as well as damaged distance of laser processing in helical mode were calculated, adopting related thermal parameters of substrate and electrode materials. The thermal damage conditions of helical and vibration mirror scan modes are compared. This method is suitable for the estimation of laser processing parameters and thermal damage zone size, beneficial to the design and match of electrode plates and chips, as well as laser processing. |
| keywords:laser processing helical cutting thermal distribution thermal damage sapphire wafer |
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