75~325 GHz宽带CMOS太赫兹外差探测器
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1沈阳航空航天大学 电子信息工程学院,辽宁 沈阳 110136;2中国科学院光电信息处理重点实验室,辽宁 沈阳 110169;3中国科学院沈阳自动化研究所,辽宁 沈阳 110169;4辽宁省太赫兹成像感知重点实验室,辽宁 沈阳 110169

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TN215

基金项目:

辽宁省青年科学基金项目B类( 2025JH6/101000029 );国家重点研发计划项目( 2023YFF0718303 );中国科学院沈阳自动化研究所基础研究计划项目( 2024JC1K08 )


75-325 GHz broadband CMOS terahertz heterodyne detector
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Affiliation:

1Electronic and Information Engineering College, Shenyang Aerospace University, Shenyang 110136, China;2Key Laboratory of Opto-Electronic Information Processing, Chinese Academy of Sciences, Shenyang 110169, China;3Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110169, China;4Key Laboratory of Terahertz Imaging and Sensing, Liaoning Province, Shenyang 110169, China

Fund Project:

Supported by the Liaoning Provincial Youth Science Fund Project Category B( 2025JH6/101000029 ), the National Key R&D Program of China ( 2023YFF0718303 ), the Fundamental Research Project of SIA ( 2024JC1K08 )

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    摘要:

    基于180 nm CMOS工艺设计并实现了一款支持直接探测和外差探测两种工作模式的宽带太赫兹(THz)探测器芯片。探测器由环形天线、NMOS晶体管差分检波电路和阻抗匹配网络组成,面积为200 200 μm2。基于环形天线的双向辐射特性,提出了将射频(RF)与本振(LO)分置于探测器两侧的布局方案,该方案无需使用分束器耦合信号,从而避免了信号的衰减。LO信号由一个外部独立的太赫兹波源产生,与片内集成的LO相比,其在频率稳定性和输出功率等方面具有优势。为了抑制硅衬底的表面波损耗,芯片背面集成了一个直径d=12 mm、厚度t=8 mm的高阻硅透镜。测试结果显示,探测器的工作频率范围覆盖了75-325 GHz,外差探测噪声等效功率(Noise Equivalent Power,NEP)优于直接探测NEP 3个数量级以上。探测器在220 GHz频点下呈现出了最佳性能,外差探测NEP为6.26 fW/Hz,直接探测NEP为18.42 pW/Hz1/2

    Abstract:

    A broadband terahertz (THz) detector chip supporting both direct detection and heterodyne detection modes is designed and fabricated using a 180 nm CMOS process. The detector consists of a loop antenna, a differential detection circuit based on NMOS transistors, and an impedance matching network, with a chip area of 200×200 μm2. Based on the bidirectional radiation characteristic of the loop antenna, a layout scheme that places the radio frequency (RF) signal and local oscillator (LO) signal on opposite sides of the detector is proposed.This scheme eliminates the need for a beam splitter for signal coupling, thereby avoiding signal attenuation. The LO signal is generated by an external independent THz source, which offers advantages in frequency stability and output power compared with on-chip integrated LO sources. To suppress the surface wave loss of the silicon substrate, a high-resistivity silicon lens with a diameter of 12 mm and a thickness of 8 mm is integrated on the backside of the chip. The measured results demonstrate that the detector operates over a broadband frequency range of 75-325 GHz. The noise equivalent power (NEP) under heterodyne detection is more than three orders of magnitude better than that under direct detection. The detector achieves its optimal performance at 220 GHz, with a heterodyne NEP of 6.26 fW/Hz and a direct detection NEP of 18.42 pW/Hz1/2.

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  • 收稿日期:2025-05-08
  • 最后修改日期:2026-03-05
  • 录用日期:2025-08-29
  • 在线发布日期: 2026-03-01
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