1中国科学院半导体研究所 半导体集成技术工程研究中心,北京 100083;2中国科学院大学 材料科学与光电研究中心,北京 100049;3中国科学院大学 材料科学与光电技术学院,北京 100049;4中国科学院大学 电子电气与通信工程学院,北京 100049;5中国科学院大学 集成电路学院,北京 100049;6怀柔实验室,北京 101499
TN386
1Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;3College of Materials Science and Opto-Electronics Technology, University of Chinese Academy of Sciences, Beijing 100049, China;4School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;5School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China;6Huairou Laboratory, Beijing 101499, China
Supported by the Strategic Priority Research Program of Chinese Academy of Sciences (XDB43020502); CAS Project for Young Scientists in Basic Research (YSBR-064).
