| HgCdTe探测器In焊凸点的失效及有限元分析 |
| Received:January 12, 2009 Revised:January 12, 2009 点此下载全文 |
| 引用本文： |
| Hits: 2525 |
| Download times: 219 |
|
| 基金项目:宁波大学王宽诚幸福基金 |
|
| 中文摘要:卫星工作时，由斯特林机致冷的HgCdTe中长波红外探测器会经受从-173℃以下到常温的成千上万次温度循环。由于不同材料的膨胀系数(CTE)不匹配，这样就会造成电极封装的疲劳和失效，进而影响卫星的正常工作。利用中科院上海技术物理研究所研制的温度循环设备TCE-a，模拟了真空环境下的斯特林制冷机的开关机模式，发现了In焊凸点的两种失效模式。运用有限元方法，对In焊凸点的失效进行了力学分析。 |
| 中文关键词:红外探测器 In焊凸点 温度循环 失效 有限元方法 |
| |
| FAILURE AND FEM ANALYSIS OF INDIUM SOLDER-BUMPS OF HgCdTe DETECTORS |
|
|
| Abstract:During satellite’s working, HgCdTe mid or long wavelength infrared (IR) detectors by the Stirling cooler are subjected to thousands of repeated thermal cycles from below -173℃ to room temperature. Due to the mismatch of coefficients of thermal expansion (CTE) of different materials, thermal cycles can cause the bonding’s fatigue and failure，even bring on the disfunction of satellites. Through the thermal cycle equipment (TCE-a) developed by SITP which simulated the vaccum environment and Stirling cooler’s intermittent working modes, we discovered two failure modes of Indium solder-bumps. And the finite elements method (FEM) is used to analyze the mechanism of bumps’ failure. |
| keywords:IR detector Indium solder-bump thermal cycle failure FEM |
| View Full Text View/Add Comment Download reader |
