| FAILURE AND FEM ANALYSIS OF INDIUM SOLDER-BUMPS OF HgCdTe DETECTORS |
| 投稿时间：2009-01-12 修订日期：2009-01-12 download |
| Citation： |
| 摘要点击次数: 4545 |
| 全文下载次数: 871 |
|
|
| Abstract:During satellite’s working, HgCdTe mid or long wavelength infrared (IR) detectors by the Stirling cooler are subjected to thousands of repeated thermal cycles from below -173℃ to room temperature. Due to the mismatch of coefficients of thermal expansion (CTE) of different materials, thermal cycles can cause the bonding’s fatigue and failure，even bring on the disfunction of satellites. Through the thermal cycle equipment (TCE-a) developed by SITP which simulated the vaccum environment and Stirling cooler’s intermittent working modes, we discovered two failure modes of Indium solder-bumps. And the finite elements method (FEM) is used to analyze the mechanism of bumps’ failure. |
| keywords:IR detector Indium solder-bump thermal cycle failure FEM |
| HTML 查看/发表评论 下载PDF阅读器 |
