FAILURE AND FEM ANALYSIS OF INDIUM SOLDER-BUMPS OF HgCdTe DETECTORS
Received:January 12, 2009  Revised:January 12, 2009  download
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Author NameAffiliationE-mail
WuLigang College of Information Science and Engineering, Ningbo University wg21c@sina.com 
Abstract:During satellite’s working, HgCdTe mid or long wavelength infrared (IR) detectors by the Stirling cooler are subjected to thousands of repeated thermal cycles from below -173℃ to room temperature. Due to the mismatch of coefficients of thermal expansion (CTE) of different materials, thermal cycles can cause the bonding’s fatigue and failure,even bring on the disfunction of satellites. Through the thermal cycle equipment (TCE-a) developed by SITP which simulated the vaccum environment and Stirling cooler’s intermittent working modes, we discovered two failure modes of Indium solder-bumps. And the finite elements method (FEM) is used to analyze the mechanism of bumps’ failure.
keywords:IR detector  Indium solder-bump  thermal cycle  failure  FEM
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Copyright:《Journal of Infrared And Millimeter Waves》