(英)倒装焊结构对太赫兹对数周期天线的影响
Received:December 25, 2016  Revised:April 06, 2017  点此下载全文
引用本文:郝海东,史君宇,成立峰,赵修臣,王兵,吕昕.(英)倒装焊结构对太赫兹对数周期天线的影响[J].Journal of Infrared and Millimeter Waves,2017,36(4):593~596
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Author NameAffiliationE-mail
HAO Hai-dong Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology 35403969@qq.com 
SHI Jun-yu Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology  
CHENG Li-feng Institute of Microelectronics, Chinese Academy of Sciences (IMECAS)  
ZHAO Xiu-chen School of Materials Science and Engineering, Beijing Institute of Technolog University  
WANG Bing Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology  
LV Xin Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology  
中文摘要:设计了一种倒装焊结构,用于340GHz的肖特基二极管探测器。探测单元是基于砷化镓(GaAs)工艺设计的。薄膜陶瓷支撑层旨在为太赫兹检测单元提供封装。通常,导电胶用作天线和输出电路之间的附接。分别对倒装焊结构和无倒装焊结构(类引线键合结构)模型对太赫兹接收天线性能的影响进行研究。为了比较的目的,使用相同的测试系统表征FC结构模型和无FC结构模型(引线键合结构)。通过引线键合与倒装焊测试增益的结果比较,表明倒装焊结构可以作为大规模太赫兹检测阵列封装的低成本解决方案。
中文关键词:关 键 词: 太赫兹  倒装焊  对数周期天线  太赫兹封装  薄膜陶瓷  肖特基二极管
 
Design of flip-chip structure effects THz log periodic antenna performance
Abstract:This paper presents a novel flip-chip (FC) structure design for 340GHz Schottky diode detectors, which are designed and fabricated based on the gallium arsenide (GaAs) process. A ceramic thin-film supporting layer is used to provide a package for such detector. Conductive adhesive is typically used as attachment material between the antenna and output circuit. The behaviour of terahertz (THz) detectors with and without the novel FC structure was studied. For comparison, the FC structure model and wire bonding structure one (free of FC) were characterized using the same test system. A comparison analysis for the gains of the THz detector measured with and without the ceramic thin-film layer indicated that the novel FC structure offers a low-cost and practical solution for packaging the array of THz detectors.
keywords:THz  Flip chip  Log periodic antenna  THz package  Thin-film ceramic  Schottky diode
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