The effect of deposition methods on the contact properties between Au/Cd electrodes and (111) CdZnTe wafers
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Affiliation:

School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China

Clc Number:

O484.1

Fund Project:

Supported by the National Natural Science Foundation of China (51472155,11675099,11505109)

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    Abstract:

    CdZnTe wafer is an ideal substrate for HgCdTe epitaxial thin films. In order to optimize the electrical contact performance of CdZnTe substrate, the Au/Cd composite electrode was prepared on p-type (111)B CdZnTe wafer (tellurium-rich surface) by vacuum evaporation and magnetron sputtering respectively. By means of contact adhesion test, the adhesion between Au/Cd electrode and CdZnTe substrate was studied. Rutherford Backscattering Spectrometry (RBS) was used to compare the element depth distribution of samples with different deposition methods. The effects of the two preparation processes on the ohmic contact characteristics of Au/Cd composite electrode and CdZnTe substrate were compared through the current-voltage (I-V) test, and the optimum preparation technology of composite electrode was obtained.

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SHI Hao-Zhi, ZHANG Ji-jun, Wang Shu-Lei, Wang Zhen-Hui, Mu Cheng-Yang, Xue Ming-Yan, Cao Meng, Huang Jian, Wang Lin-Jun, Xia Yi-Ben. The effect of deposition methods on the contact properties between Au/Cd electrodes and (111) CdZnTe wafers[J]. Journal of Infrared and Millimeter Waves,2020,39(5):596~602

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History
  • Received:December 16,2019
  • Revised:October 12,2020
  • Adopted:February 08,2020
  • Online: October 12,2020
  • Published: