MEASUREMENT OF RESIDUAL STRESS IN SILICON INDUCED BY THE FABRICATION OF POWER RECTIFIER USING INFRARED PHOTOELASTICITY
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O434.39

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    Abstract:

    With the help of infrared photoelatic system,the residual stress induced by diffusion and nickelage process in the fabrication of power rectifier was measured and analyzed. The residual stress and stress distribution of diffusing boron-aluminium, diffusing phosphorus and plating nickel in silicon wafer were obtained by using the Senarmont compensation method.

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Wang Yuzhong, Zhao Shounan, Huang Lan. MEASUREMENT OF RESIDUAL STRESS IN SILICON INDUCED BY THE FABRICATION OF POWER RECTIFIER USING INFRARED PHOTOELASTICITY[J]. Journal of Infrared and Millimeter Waves,1995,14(6):

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