一种新型环形上DBR刻蚀微结构VCSEL及其空心光束
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长春理工大学 高功率半导体激光国家重点实验室,吉林 长春 130000

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TN248.4

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A novel ring-shaped top-DBR etched microstructure VCSEL with a hollow beam
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State Key Lab on High Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun 130000, China

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Supported by Jilin Province Science and Technology Department project (20220101122JC); Changchun University of Science and Technology project (627011102).

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    摘要:

    设计了带有质子注入高阻区的刻蚀微结构面发射半导体激光器结构,使得从出光口到上DBR形成环形波导,进而直接产生空心激光束输出。使用FDTD 软件计算了刻蚀微结构VCSEL的光场分布,得到的环形模式图样在不同模式数目下都能保持空心光束的特性。制备了室温下激射波长为848 nm的微结构VCSEL,并测试其输出特性。阈值电流为0.27 A,峰值功率最高可达170 mW。不同电流下的近场图都显示出非常明显的空心环形光斑,远场光强分布曲线也符合空心光束的特性。该新型VCSEL技术为空心光束甚至阵列器件的发展提供了一种新的方法。

    Abstract:

    The structure of a novel ring-shaped top-DBR etched microstructure VCSEL with a proton implantation high resistance region was designed. A ring column structure was formed from the upper electrode to the active region, which directly generated a hollow laser beam output. The optical field distribution of the etched microstructure VCSEL was calculated by FDTD software, and the obtained ring-shaped patterns maintained the hollow beam characteristics under the different mode numbers. We fabricated the etched microstructure VCSEL with a lasing wavelength of 848 nm at room temperature and investigated its performance. The threshold current was 0.27 A and the peak power was up to 170 mW. The near-field patterns of different currents clearly displayed hollow ring-shaped spots. The distribution curves of far-field light intensity matched the characteristics of a hollow beam as well. This novel VCSEL provides a new approach for the development of hollow beams and even array devices.

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逄超,晏长岭,杨静航,钱冉,李奕霏.一种新型环形上DBR刻蚀微结构VCSEL及其空心光束[J].红外与毫米波学报,2023,42(4):462~467]. PANG Chao, YAN Chang-Ling, YANG Jing-Hang, QIAN Ran, LI Yi-Fei. A novel ring-shaped top-DBR etched microstructure VCSEL with a hollow beam[J]. J. Infrared Millim. Waves,2023,42(4):462~467.]

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  • 收稿日期:2022-11-24
  • 最后修改日期:2023-06-05
  • 录用日期:2023-02-02
  • 在线发布日期: 2023-06-02
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