Residual stress matching is critical for elimination of deformation for terahertz (THz) microbolometer with micro-bridge structure. Finite element simulation model of micro-bridge was built with a pixel size of 35 μm×35 μm. Intellisuite was used for mechanics simulation based on orthogonal experimental design. A minimum deformation of 0.0385 μm was obtained with an optimized stress combination when the residual stresses of support layer, passivation layer, electrode layer, sensitive layer and absorption layer were +200 MPa, +200 MPa, +200 MPa, 0 MPa and -400 MPa, respectively. 320×240 THz focal plane array was fabricated with the optimized stress combination. A minimal deformation was achieved, which agreed well with the simulation.