0.5μm InP/InGaAs DHBT with 350/533 GHz ft/fmax and two layers of interconnecting technology were developed for ultra high speed digital integrated circuit (IC) application. A static divide-by-2 frequency divider operating at 100 GHz was demonstrated. As the important parameters of gate delay, base-collector capacitance Ccb and Ccb/IC were analyzed. The value of Ccb/IC as low as 0.4 ps/V was achieved, indicating that frequency divider operating above 150 GHz could be potentially realized.