(英)基于GaN TMIC集成片上天线技术的太赫兹功率放大器
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1.北京理工大学 毫米波与太赫兹技术北京市重点实验室,北京 100081;2.河北半导体研究所,河北 石家庄;050051

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O43

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Terahertz power amplifier integrated with on-chip antenna using GaN TMIC technology
Author:
Affiliation:

1.School of Information and Electronics, Beijing Institute of Technology, Beijing 100081, China;2.Hebei Semiconductor Research Institute, Shijiazhuang 050051,China

Fund Project:

National Natural Science Foundation of China 61527805Supported by National Natural Science Foundation of China (61527805).

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    摘要:

    介绍了一种由矩形微带贴片天线和功率放大器一体化集成设计的发射类型单片太赫兹集成电路.该电路采用 GaN HEMT 工艺制备, 实现了高功率密度和高效集成.片上天线被设计为功率放大器输出端接的功率辐射器和频率相关的输出负载调谐器.采用负载牵引技术实现了放大器与天线之间良好的阻抗匹配.在 100~110 GHz的频带范围内, 功率放大器的平均输出功率为 25.2 dBm, 平均功率附加效率(PAE) 为5.83%.单片太赫兹集成电路具有良好的辐射特性, 芯片的10 dB带宽为 1.5 GHz, 在109 GHz估算的等效各向同性辐射功率 (EIRP) 为 25.5 dBm.

    Abstract:

    This paper presents a transmitter-type TMIC integrated with a rectangular microstrip patch antenna and a power amplifier. The TMIC was fabricated with GaN HEMT technology for high power density and efficient integration. The on-chip antenna was designed as a power radiator and a frequency-dependent output load tuner of the power amplifier. Load-pull technique was used to realize a good impedance match between the amplifier and the antenna. Over a bandwidth of 100~110 GHz, the power amplifier can deliver an average output of 25.2 dBm with a power-added efficiency (PAE) of 5.83%. Good radiation characteristics of the TMIC have been achieved, showing a 10-dB bandwidth of 1.5 GHz and an estimated equivalent isotropic radiated power (EIRP) of 25.5 dBm at 109 GHz.

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王旭东,吕昕,郭大路,李明迅,程功,刘嘉山,于伟华.(英)基于GaN TMIC集成片上天线技术的太赫兹功率放大器[J].红外与毫米波学报,2019,38(6):683~689]. WANG Xu-Dong, LV Xin, GUO Da-Lu, LI Ming-Xun, CHENG Gong, LIU Jia-Shan, YU Wei-Hua. Terahertz power amplifier integrated with on-chip antenna using GaN TMIC technology[J]. J. Infrared Millim. Waves,2019,38(6):683~689.]

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  • 收稿日期:2019-06-05
  • 最后修改日期:2019-11-24
  • 录用日期:2019-08-14
  • 在线发布日期: 2019-12-06
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