Filters are essential components of communication systems. A rapid and accurate fabrication method is presented in this paper for the design and fabrication of a waveguide filter. The filter was fabricated by using a multi-layer coating and one-time ultraviolet exposure lithography (SU-8 resist on a silicon wafer) to have dimensional fabrication errors of less than 3 μm in height and 1.1° in vertical angle deviation. We demonstrated the feasibility of the proposed class of filters and the fabrication method used and achieved a superior performance (with regard to: insertion loss, return loss, and bandwidth). Consequently the minimum passband insertion loss, which is practically negligible, was measured as being less than 0.5 dB while the return loss is greater than 10 dB during the passband, demonstrating that the chosen rapid fabrication technology is an effective method of terahertz device fabrication. The new technology should become a major driving force forging the future development of terahertz RF devices.