Wire sawing technology has been widely used in the field of semiconductor crystal cutting. The traditional internal cutting technology is introduced, and the current classification and research level of the emerging wire saw cutting technology are summarized. The working principles and research progress of the two major categories of free abrasive wire saw cutting and consolidated abrasive wire saw cutting are explained. Free-abrasive wire saw cutting is a widely used technology to replace inner circular cutting, while solid-abrasive wire saw cutting is an important improvement for high cutting efficiency requirements. A review of cutting technology for crystal wire saws will help researchers understand cutting-edge research progress and grasp the development direction of crystal wire saw cutting.