The characteristics of the adhesion between a thin film and its substrate have been being much concerned. The performance of the thin film depends on the adhesion between the film and its substrate in all cases. To enhance the adhesion, the adhesion mechanism should be understood fully and the appropriate technology for measuring adhesion is required. The adhesion is evaluated in terms of basic adhesion, thermodynamic adhesion energy and actual adhesion. As the widely used adhesion test technologies, the pull-off test and peel test methods show their unique superiority in dealing with a large number of samples and can be used to evaluate the adhesion performance of thin films qualitatively and semi-quantitatively.