| 基于电磁仿真的红外成像电路板优化设计 |
| 投稿时间：2023-12-18 修订日期：2024-01-10 点此下载全文 |
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| 中文摘要:本研究致力于通过仿真技术对红外成像电路板(Printed Circuit Board,PCB）进行优化，以提高其抗电磁干扰（Electromagnetic Interference,EMI）能力。基于ANSYS SIWAVE仿真平台，我们聚焦于识别并解决 PCB 在电磁环境中可能面临的问题，以提高系统的可靠性和性能。首先，通过对电路板进行模态分析和频域分析，我们识别了潜在的谐振频率和电磁辐射点。接着，通过添加去耦电容的方式来消除该谐振频点，再通过对高速信号过孔孔径的仿真研究，调整布线方案，优化信号传输路径，对关键信号线进行保护等措施，降低了信号失真和时序问题的风险。仿真结果表明，这些优化措施在提高PCB性能和稳定性方面取得了显著的效果。 |
| 中文关键词:红外成像 EMI PCB ANSYS SIWAVE |
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| Optimized design of infrared imaging circuit board based on electromagnetic simulation |
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| Abstract:This study is committed to optimizing the circuit board (Printed Circuit Board,PCB) through simulation technology to improve its anti -electromagnetic interference (Electromagnetic Interference,EMI) ability. Based on the ANSYS SIWAVE simulation platform, we focus on identifying and solving problems that PCBs may face in the electromagnetic environment to improve system reliability and performance. First of all, by conducting modular analysis and frequency domain analysis of the circuit board, we identify potential resonance frequency and electromagnetic radiation points. Then, the resonance frequency point is eliminated by adding an decoupling capacitor, and then the wiring scheme is adjusted through simulation of high -speed signal pores, optimizing the signal transmission path, and protecting key signal lines. Risk of time -order issues. The simulation results show that these optimization measures have achieved significant results in improving PCB performance and stability. |
| keywords:infrared imager EMI PCB ANSYS SIWAVE. |
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