| 像素滤光片的微米级装配工艺研究 |
| 投稿时间：2023-11-21 修订日期：2023-12-08 点此下载全文 |
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| 中文摘要:为满足红外探测器多通道精细分光的应用需求，像素滤光片需精准地集成在红外探测器组件的冷头上，且滤光片X、Y、Z向装配精度需要控制在10μm以内，以降低不同通道间的杂散光干扰。本文中像素滤光片基于中波320×256@30μm探测器进行设计，以探测器上相邻的四个像元为一组，每个像元在像素滤光片上的对应区域有各自的吸收谱段。通过对比分析胶黏剂和金属滤光片支架分别作为像素滤光片的支撑结构时的四像元光谱吸收曲线，可知胶黏剂作为像素滤光片的微支撑结构时，Z向装配间距可低至2μm ~10μm，与滤光片支架结构相比，截止波段外的杂散光吸收可降低25%~50%。结果表明：将胶黏剂作为滤光片的微支撑结构的装配工艺能够有效解决像素级滤光片的杂散光干扰问题。 |
| 中文关键词:红外探测器 像素滤光片 滤光片封装工艺 |
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| Micron-scale Assembly Process Research on Pixel Filter |
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| Abstract:To meet requirements of precise multi-channel spectroscopy for infrared detectors, pixel-level filters need to be accurately integrated onto the cold head of the infrared detector assembly, with assembly accuracy in the X, Y, and Z directions controlled within 10μm to reduce crosstalk interference between different channels. In this paper, the pixel-level filter is designed based on a mid-wave 320×256@30μm detector, with adjacent four pixels on the detector forming a group, and each pixel having its own absorption spectrum segment on the corresponding region of the pixel-level filter. By comparing and analyzing the four-pixel spectral absorption curves when using adhesive and metal filter support structures as the support structure for the pixel-level filter, respectively, it is found that when adhesive is used as the micro-support structure for the pixel-level filter, the Z-direction assembly spacing can be reduced to 2~10μm. Compared with the filter support structure, the stray light absorption outside the cutoff band can be reduced by 25%~50%. The results indicate that using adhesive as the assembly process for the micro-support structure of the filter can effectively address the issue of stray light interference in pixel-level filters. |
| keywords:Infrared detector, pixel filter, filter packaging process |
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