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红外探测器杜瓦窗口钎焊工艺优化
投稿时间:2024-11-12  修订日期:2024-11-28  点此下载全文
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作者单位地址
李云龙 华中科技大学材料科学与工程学院 湖北省武汉市洪山区关山街道珞喻路1037号华中科技大学
沈星* 武汉高德红外股份有限公司 
吴丰顺 华中科技大学材料科学与工程学院 
周龙早 华中科技大学材料科学与工程学院 
宋立志 武汉高德红外股份有限公司 
洪晓麦 武汉高德红外股份有限公司 
中文摘要:杜瓦窗口,作为红外探测器核心部件之一,其焊接质量对探测器的真空维持时长及长期运行的稳定性具有决定性影响。本试验通过引入两种预成型焊料环进行真空钎焊,替代传统的手工SAC305焊膏软钎焊工艺,对杜瓦窗口的外观质量、气密性能、空洞率以及焊接强度进行研究分析。试验结果表明,当使用具有中间层Ni骨架结构的SnAgCu复合焊料环进行真空钎焊时,杜瓦窗口漏率可以达到小于1×10-12Pa·m3/s的高气密性要求,空洞率可以降低至1%,对杜瓦窗口进行抗拉强度测试,结果表明,当工艺参数为250℃、5min、0.32MPa时,抗拉强度达到最大值66.73MPa,与传统手工SAC305焊膏软钎焊接头相比,增加了10.19%,同时,该方法可以改善工艺一致性,大幅提升生产效率,对杜瓦窗口量产工艺具有重要指导意义。
中文关键词:杜瓦窗口  焊接空洞  工艺优化
 
Optimization of Soldering Process for Dewar Windows in Infrared Detectors
Abstract:The Dewar window, as one of the core components of infrared detectors, plays a decisive role in the vacuum retention time and long-term stability of the detector. This experiment introduces two types of preformed solder for vacuum brazing, replacing the traditional manual SAC305 solder paste soft soldering process, to study and analyze the appearance quality, hermetic performance, void rate, and welding strength of the Dewar window. The results show that when using SnAgCu composite solder with a middle layer Ni skeleton structure for vacuum brazing, the Dewar window leak rate can achieve a high hermeticity requirement of less than 1×10-12 Pa·m3/s, and the void rate can reduced to 1%. Tensile strength tests on the Dewar window indicate that when the process parameters are set at 250°C, 5minutes, and 0.32MPa, the tensile strength reaches a maximum value of 66.73MPa, which is an increase of 10.19% compared to the traditional manual SAC305 solder paste soft soldered joints. Additionally, this method can improve process consistency and significantly increase production efficiency, which is of great significance for the mass production process of Dewar windows.
keywords:Dewar window, Solder void, Process optimization
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